|
| Item |
Specifications |
| Layers count |
Uclad, 1~64Layers(Flex-Rigid PCB: Max Layer. 8Layers) |
| Board Thickness |
Thickness scope:8mil(0.20mm)~236mil(6.0mm) |
| Min. thickness: Double side: 8mil(0.20mm) |
| 4 layers: 16mil(0.40mm) |
| 6 layers: 32mil(0.80mm) |
| 8 layers: 40mil(1.00mm) |
| 10 layers/ 12 layers: 48mil(1.20mm) |
| Board material type |
FR-4 94V0 (or High Tg), CEM series, Aluminium Clad, Flex-Rigid mix, Halogen Free,Rogers,PTFE,etc |
| Copper foil weight |
12um(1/3oz)~210um(6oz) |
| Prepreg |
106, 1080, 2116, 7628, 7628H,RO4403,RO4450B |
| Max Board Size |
24"X30" |
| Min. track width/gap |
Inner layer: 3mil(0.075mm)/4mil(0.10mm) [base cu≤35um(1oz)] |
| Outer layer: 4mil(0.10mm)/4mil(0.10mm) [base cu: 12um(1/3oz)] |
| 4.Omil(0.10mm)/4.0mil(0.10mm) [base cu: 18um(0.5oz)] |
| 5mil(0.127mm)/4.5mil(0.127mm) [base cu: 35um(1oz)] |
| 6.7mil(0.11mm)/6.7mil(0.11mm) [base cu: 70um(2oz)] |
| 8mil(0.20mm)/8mil(0.20mm) [base cu: 105um(3oz)] |
| Over 105um(3oz), We need the Gerber file to affirm! |
| Min. annular ring |
Inner layer: 2mil(0.05mm)/side |
| Outer layer: 5mil(0.127mm)/side |
| BGA PAD |
Min. BGA PAD size:10mil(0.254mm) |
| Base copper Weight |
Inner layer: 18um(0.5oz)~210um(6oz) |
| Outer layer: 12um(1/3oz)~245um(7oz)[Max. Cu thick of Multi-layer:175um(5oz)] |
| Layer to layer misalignment |
4mil(0.10mm) |
| Hole diameter |
Machine drilling diameter scope:8mil(0.20mm)~255mil(6.5mm) |
| Min. PTH Slot diameter: 24.6mil(0.60mm) |
| Min.Burying via hole diameter scope: 6mil(0.15mm)~14mil(0.35mm) |
| Laser drilling via hole diameter(Blinding): 4mil(0.10mm) |
| Max. depth of Blind via hole(Isolation thickness):4mil(0.10mm) |
| Max. aspect ratio of blind via hole: 0.75:1 |
| Counter Sink/Counter Bore diameter: 23.6mil(0.60mm)~250mil(6.35mm) |
| NPTH tolerance: ±2mil(0.05mm) & ±1.5mil(0.038mm)(special required) |
| PTH tolerance: ±3mil(0.08mm) & ±2mil(0.05mm)(special required) |
| Positional tolerance: PTH ±3mil(0.08mm) NPTH ±2mil(0.05mm) |
| PTH aspect ratio: 8:1 |
| Solder-mask |
Solder-mask type: Glossy Liquid Photo Imageable(LPI) /Matte |
| Color: Green, Black, White, Red, Blue, Achromaticity/clear,Yellow etc |
| Solder Mask Abrasion ≥6H |
| Solder mask thickness: 0.4mil(10um)~1.18mil(30um) |
| Min. soldermask bridge/bam:4mil(0.10mm) |
| Plugged via hole with soldermask:8mil(0.20mm)~27.6mil(0.70mm) |
| Silkscreen/Legend |
Silkscreen color: Black,White,Red, Yellow,etc |
| Surface treatment |
Lead HASL SnPb thickness: 0.08mil(2.0um)~1.181mil(30um) |
| Lead Free HASL thickness: 0.08mil(2.0um)~1.181mil(30um) |
| Immersion Ni/Au: Ni thickness: 0.1mil(2.54um)~0.236mil(6um) |
| Gold thickness: 0.002mil(0.05um)~0.005mil(0.127um) |
| Selective gold plating thick Au: Ni thick:0.1mil(2.54um)~0.315mil(8um) |
| Hard Gold:0.04mil(1um)~0.118mil(3um) |
| OSP/Entek thickness: 0.006mil(0.15um)~0.018mil(0.45um) |
| Immersion silver thickness: 0.003mil(0.08um)~0.018mil(0.45um) |
| Immersion Tin thickness: 0.003mil(0.08um)~0.018mil(0.45um) |
| Flash Gold/Plating Gold: Ni thick: 0.1mil(2.54um)~0.16mil(4um) |
| Au thick: 0.001mil(0.0254um)~0.003mil(0.0762um) |
| Plating Gold Finger: Ni thick: 0.1mil(2.54um)~0.16mil(4um) |
| Au thick: 0.01mil(0.254um)~0.030mil(0.762um) |
| Peelable-mask |
Mask thickness: 8mil(0.20mm)~16mil(0.40mm) |
| Peel strength:1.4N/mm |
| Carbon(conductive) ink |
Ink thickness≤ 0.8mil(20um) |
| Carbon resistance≤35Ω/cm2 |
| Profile/outline |
CNC Routing: Profile tolerance:±6mil(0.15mm) (General) |
| ±4mil(0.10mm)(special required) |
| Routing tooling size:≥31.5mil(0.8mm) |
| Profile positional tolerance:±5mil(0.127mm) |
| V-CUT: Type: Straight Lines, Jump Scoring(CNC-VCUT) |
| Angle type:15°,30°,45° |
| V-CUT angle tolerance:±5° |
| Min. WEB tolerance: ±4mil(0.10mm) |
| V-CUTmisalignment tolerance: ±4mil(0.10mm) |
| Punched: Profile tolerance:±6mil(0.15mm) (General) |
| ±4mil(0.10mm)(special required) |
| Positional tolerance:±5mil(0.127mm) |
| Min. pin size: 31.5mil(0.8mm) |
| Gold finger bevel: Profile tolerance: ±8mil(0.20mm) (General) |
| ±6mil(0.15mm)(special required) |
| Angle:20°(General) & Angle tolerance:±5° |
| E-test/BBT |
AOI test: Max. test area: 22"X26" |
| Flying probe test: Min. solder pad size: 0.02mm |
| Min. pad center distance: not be limited |
| Max. test area: 19"X24" |
| Generic fixture test: E-test voltage:5~300v |
| Isolation Resistance: 1MΩ~100MΩ |
| Continuity Resistance: 10Ω~100Ω |
| Min. solder pad size: 8mil(0.20mm) |
| Min. pad center distance: 16mil(0.40mm) |
| Max. test area: 20"X25" |
| Control-impedance |
Impedance type: Differential impedance |
| Single microstrip impedance |
| Tolerance: ±10%(General), ±8%(special required) |
| Delivery panel size |
Max. size: 18"X20" Min. siz: 2.36"X3.15" |
| Warp&Twist |
No SMT required: ±1.5%(General); SMT required: ±0.75% |
| Checking and accepted standard |
IPC-600F ClassII,ClassIII,etc |
